BGA Assembly
What is BGA?
BGA ( Ball Grid Array) is an IC package type that is high-performance, tiny in size, and lightweight. A ball grid array (BGA) is a chip carrier used for integrated circuits, similar to surface-mount packaging. These are used to SMD chips with hundreds of pins (such as microprocessors).
In comparison to a dual in-line or flat package, a BGA can offer additional connectivity pins for ICs. Instead of just the edge, it frequently utilizes the full device’s bottom surface.
BGA Assembly
A BGA assembly is the process of putting the IC chip on the BGA board. The process of putting an SMD package chip on the PCB board is called SMD assembly. But unlike SMD assembly, BGA soldering needs to be done with very precise control and must be done by machines.
Ability of BGA Assembly
We have extensive expertise working with all different types of BGAs, ranging in size from small (2 mm x 3 mm) to big (45 mm), ceramic, and plastic BGAs. We can install BGAs with a minimum 0.2 mm pitch on your PCB.
BGA Assembly Process
In the PCB assembly process, the thermal profile is crucial for BGA. To create an ideal thermal profile for your BGA assembly procedure, our production team will do carefully DFM Check on your PCB files and the BGA datasheet. In order to create effective thermal profiles, we will take into account the BGA size and the BGA ball material properties (leaded or lead-free). We adhere to the IPC Class II or Class III Quality Management standards to ensure that any voids are less than 25% of the overall solder ball diameter.
Upon receiving your Turn-Key PCB Assembly order, we will conduct a thorough DFM (Design for Manufacturability) evaluation of your PCB design to evaluate any BGA-specific factors. Checks for PCB Laminate Material compatibility, Surface Finish effects, maximum warpage requirement, and Solder Mask clearance are included in the comprehensive verification. All of these aspects affect BGA assembly quality.
X-Ray Inspection for BGA Assembly
We employ X-Ray inspection to detect any BGA assembly problems. Through X-ray inspection, we can identify soldering issues, such as Solder Balls and Paste Bridging, on the circuit board. In addition, our X-Ray support program can compute the ball’s gap size to ensure IPC Class II or Class III compliance, based on your specifications. Our expert technicians also could employ 2D X-rays to generate 3D images in order to inspect issues such as damaged PCB vias, and cold solder joints in BGA balls.
